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HA17324F/FP
Quad Operational Amplifier
Description
HA17324 is quad operational amplifier that provide high gain and internal phase compensation, with single power supply. They can be widely used to control equipments.
Features
* Wide range of supply voltage, and single power supply used * Internal phase compensation * Wide range of common mode voltage, and possible to operate with an input about 0V
Pin Arrangement
Notice:
The example of an applied circuit or combination with other equipment shown herein indicates characteristics and performance of semiconductor -applied products. The company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example. Specifications and information
Preliminary: This document contains information on a new product. contained herein are subject to change without notice.
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HA17324F/FP
Circuit Schematic (1/4)
Ordering Information
Type No. HA17324FP HA17324F Application Industrial use Commercial use Package FP-14DA FP-14DA
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HA17324F/FP
Absolute Maximum Ratings (Ta = 25C)
Item Supply voltage Sink current Power dissipation Common mode input voltage Differential input voltage Operating temperature Storage temperature Symbol VCC Isink PT VCM Vin (diff) Topr Tstg Rating 32 50 625* -0.3 to VCC VCC -20 to +75 -55 to +125 Unit V mA mW V V C C
Note: Tjmax is shown as follows. Tjmax = j-a * PCmax + Ta (j-a; Thermal resistor between junction and ambient at set board use). The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. And PCmax cannot be over the value of PT.
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HA17324F/FP
Electrical Characteristics (VCC = +15V, Ta = 25C)
Item Input offset voltage Input offset current Input bias current Power source rejection ratio Voltage gain Common mode rejection ratio Common mode input voltage range Maximum output voltage Output source current Output sink current Supply current Power dissipation Slew rate Channel separation Output sink current Symbol VIO IIO II PSRR AVD CMR VCM Vop-p Isource Isink ICC PT SR CS Isink Isink Output voltage Output voltage VOH VOH VOL VOL Min -- -- -- -- 75 -- -0.3 -- 20 10 -- -- -- -- 15 3 13.2 12.0 -- -- Typ 2 5 30 93 90 80 -- 13.6 40 20 0.8 12 0.19 120 50 9 13.6 13.3 0.8 1.1 Max 7 50 500 -- -- -- 13.5 -- -- -- 2 30 -- -- -- -- -- -- 1.0 1.8 Unit mV nA nA dB dB dB V V mA mA mA mW V/s dB A mA V V V V Test Conditions VCM = 7.5V, RS = 50, Rf = 50k VCM = 7.5V, IIO = | II (-) - II (+) | VCM = 7.5V f = 100Hz, RS = 1k, Rj = 100k RS = 1 k, Rf = 100k, RL = RS = 50, Rf = 5k RS = 1k, Rf = 100k, f = 100Hz f = 100Hz, RS = 1k, Rf = 100k, RL = 20k VIN = 1V, VIN = 0V, VOH = 10V VIN = 0V, VIN = 1V, VOL = 2.5V VIN = GND, RL = RL = , VIN = GND f = 1.5kHz, VCM = 7.5V, RL = f = 1kHz VIN = 0V, VIN = 1V, VOL = 200mV VIN = 0V, VIN = 1V, VOL = 1V IOH = -1mA IOH = -10mA IOL = 1mA IOL = 10mA
+ - + - + -
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HA17324F/FP
Characteristics Curve
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HA17324F/FP
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HA17324F/FP
Solder Mounting Method
1. Small and light surface-mount packages require spicial attentions on solder mounting. On solder mounting, pre-heating before soldering is needed. The following figure show an example of infrared rays refow. 2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress. Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates.
Figure 1 An Example of Infrared Rays Reflow Conditions
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